JPS63114032U - - Google Patents
Info
- Publication number
- JPS63114032U JPS63114032U JP513287U JP513287U JPS63114032U JP S63114032 U JPS63114032 U JP S63114032U JP 513287 U JP513287 U JP 513287U JP 513287 U JP513287 U JP 513287U JP S63114032 U JPS63114032 U JP S63114032U
- Authority
- JP
- Japan
- Prior art keywords
- rail
- pair
- semiconductor device
- guide
- members
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP513287U JPS63114032U (en]) | 1987-01-16 | 1987-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP513287U JPS63114032U (en]) | 1987-01-16 | 1987-01-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63114032U true JPS63114032U (en]) | 1988-07-22 |
Family
ID=30786433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP513287U Pending JPS63114032U (en]) | 1987-01-16 | 1987-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63114032U (en]) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59189645A (ja) * | 1983-04-12 | 1984-10-27 | Tokyo Seimitsu Co Ltd | 半導体素子の加熱搬送装置 |
| JPS625108B2 (en]) * | 1979-05-09 | 1987-02-03 | Yamaha Motor Co Ltd |
-
1987
- 1987-01-16 JP JP513287U patent/JPS63114032U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS625108B2 (en]) * | 1979-05-09 | 1987-02-03 | Yamaha Motor Co Ltd | |
| JPS59189645A (ja) * | 1983-04-12 | 1984-10-27 | Tokyo Seimitsu Co Ltd | 半導体素子の加熱搬送装置 |